Industry Solutions (Electronic Devices) Microelectronics
Introduction of application examples for material testing of microelectronics components and parts.
As electronic devices become smaller, they are also becoming more complex, and manufacturers along with their supply chains are required to miniaturize intermediate components in conjunction with the use of high-density packaging. Instron, as a global leader in materials testing systems, provides a wide range of solutions that meet industry standards such as JEDEC, MIL, SEMI, as well as IPC TM-650, AEC-Q100, and AEC-Q200. These solutions cover a variety of tests, from micro-bending tests of electronic packages to shear tests of integrated circuits (ICs) and bending tests of printed circuit board (PCB) finished products. 【Common Applications】 ■ Compression testing of IC packages ■ Die shear testing of electronic packages ■ Peel testing of copper runners ■ Micro-bending tests of PCBs *For more details, please refer to the PDF materials or feel free to contact us.
- Company：インストロンジャパンカンパニイリミテッド 日本支社
- Price：Other
